Date of Award
2004
Degree Type
Thesis
Degree Name
Master of Science (MS)
Department
Materials Engineering
Recommended Citation
Chung, Hsiu-hsin, "Effect of geometry on solder joint reliability of leadless leadframe package" (2004). Master's Theses. Paper 2696.
http://scholarworks.sjsu.edu/etd_theses/2696
COinS