Document Type
Article
Publication Date
2001
Publication Title
Journal of Materials Education
Volume
23
Issue Number
1-3
First Page
69
Last Page
76
Abstract
Materials Science and Engineering straddles the fence between engineering and science. In order to produce more work-ready undergraduates, we offer a new interdisciplinary program to educate materials engineers with a particular emphasis on microelectronics-related manufacturing. The bachelor's level curriculum in Microelectronics Process Engineering (J1ProE) is interdisciplinary, drawing from materials, chemical, electrical and industrial engineering programs and tied together with courses, internships and projects which integrate thin film processing with manufacturing control methods. Our graduates are prepared for entry level engineering jobs that require knowledge and experience in microelectronics-type fabrication and statistics applications in manufacturing engineering. They also go on to graduate programs in materials science and engineering. The program objectives were defined using extensive input from industry and alumni. We market our program as part of workforce development for Silicon Valley and have won significant support from local industry as well as federal sources. We plan to offer a vertical slice of workforce development, from lower division engineering and community college activities to industry short courses. We also encourage all engineering majors to take electives in our program. All our course and program development efforts rely on clearly defined learning objectives.
Recommended Citation
E. Allen, Stacy H. Gleixner, G. Young, David W. Parent, Yasser Dessouky, and L. Vanasupa. "Microelectronics Process Engineering: A Non-Traditional Approach to MS&E (Ingeniería de Procesos Microelectrónicos: Un Acercamiento no Tradicional a la Ciencia de Materiales e Ingeniería)" Journal of Materials Education (2001): 69-76.
Comments
This article was published by The International Council on Material Education and appeared in the Journal of Materials Education, volume 23, issue 1-3, 2001. It is included here with the permission of the editors.