Printing of electromagnetic interference shielding materials

Publication Date

6-1-2023

Document Type

Article

Publication Title

Flexible and Printed Electronics

Volume

8

Issue

2

DOI

10.1088/2058-8585/acc879

Abstract

The proliferation of electronic devices has made electromagnetic interference (EMI) shielding an exponentially growing business. Regulatory requirements change constantly as new technologies continue to emerge. Innovations in materials and new advances in shielding implementation techniques are needed to pass regulatory compliance tests at an affordable cost. Here, we print various EMI shielding materials such as copper, silver and a composite of copper with Fe3O4 using plasma jet printing. Printing enables shields only a few microns thick capable of high shielding effectiveness. Copper’s EMI shielding performance is primarily contributed by reflection mechanism, as expected and this is known to cause secondary pollution. A Green Index for EMI shielding, given by the ratio of absorption and reflection contributions to shielding, indicates values lower than 0.1 for printed copper films.

Funding Number

DE-SC0022744

Keywords

atmospheric pressure plasma jet, electromagnetic interference shielding, metal printing, plasma printing

Department

Electrical Engineering

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