Development of a Heatsink with Embedded Thermosyphons for Passive Cooling of High-Power LED Panels
Publication Date
1-1-2024
Document Type
Conference Proceeding
Publication Title
2024 IEEE Integrated STEM Education Conference, ISEC 2024
DOI
10.1109/ISEC61299.2024.10665092
Abstract
High-energy LED panels find diverse applications, ranging from indoor to space agriculture. While LED panels are generally efficient, they tend to produce significant heat, impacting their effectiveness and posing a risk of permanent damage. Active cooling methods, such as fans, not only consume excessive energy but are prone to failure, potentially reducing the panel's overall lifespan. This research explores a traditional passive cooling technique that integrates a heatsink with embedded thermosyphons operating at low pressure. The thermosyphons evaporate the fluid, which then condenses at the condenser end, releasing heat to the environment. The condensed liquid returns to the evaporator section due to gravity. In this study, an effort is made to combine these two passive techniques by designing a heat sink with embedded thermosyphons.
Department
Mechanical Engineering
Recommended Citation
Ayush Guha, Ayaan Raza, and Sohail Zaidi. "Development of a Heatsink with Embedded Thermosyphons for Passive Cooling of High-Power LED Panels" 2024 IEEE Integrated STEM Education Conference, ISEC 2024 (2024). https://doi.org/10.1109/ISEC61299.2024.10665092
