Extreme ultraviolet induced chemistry in polymer thin films

Publication Date

1-1-2025

Document Type

Conference Proceeding

Publication Title

Proceedings of SPIE the International Society for Optical Engineering

Volume

13428

DOI

10.1117/12.3051486

Abstract

Extreme ultraviolet (EUV) lithography relies on the development of advanced photoresist materials with optimized sensitivity, resolution, and etch resistance. Understanding the fundamental mechanisms of EUV-induced chemical transformations is crucial for improving resist performance. In this study, we investigate the EUV-induced degradation of poly(tert-butyl methacrylate) (PtBMA) and its copolymer with poly(4-hydroxystyrene) (P(tBMA-co-HS)). Using mass spectrometry, film thickness measurements, and Fourier-transform infrared (FTIR) spectroscopy, we analyze outgassing behavior, material loss, and molecular transformations in these polymers. Our results reveal that PtBMA undergoes significant fragmentation beyond simple deprotection, leading to higher outgassing and film shrinkage, while P(tBMA-co-HS) exhibits enhanced stability. These findings provide insights into polymer composition effects on EUV resist behavior and inform strategies for designing more robust photoresists for next-generation lithographic applications.

Funding Number

FP00017797

Funding Sponsor

U.S. Department of Energy

Keywords

electron-induced chemistry, extreme ultraviolet (EUV), extreme ultraviolet lithography, lithography, photoresist, polymers, secondary electrons

Department

Chemical and Materials Engineering

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