Publication Date
1995
Degree Type
Thesis
Degree Name
Master of Science (MS)
Department
General Engineering
Recommended Citation
Lynch, B. J. (Brian John), "Copper tin intermetallic compounds in flip chip interconnections" (1995). Master's Theses. 1087.
DOI: https://doi.org/10.31979/etd.g3jg-zjcd
https://scholarworks.sjsu.edu/etd_theses/1087
COinS
