Publication Date
2004
Degree Type
Thesis
Degree Name
Master of Science (MS)
Department
Materials Engineering
Recommended Citation
Chung, Hsiu-hsin, "Effect of geometry on solder joint reliability of leadless leadframe package" (2004). Master's Theses. 2696.
DOI: https://doi.org/10.31979/etd.hm3x-v3j2
https://scholarworks.sjsu.edu/etd_theses/2696
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