Publication Date

Spring 2025

Degree Type

Thesis

Degree Name

Master of Science (MS)

Department

Electrical Engineering

Advisor

Hiu Yung Wong; Ehsan Khatami; Ken Wharton; Yaniv Rosen

Abstract

This work presents a comprehensive analytical and simulation-based study of superconducting quantum chip architectures, spanning both 2D planar and 3D-integrated designs. We first design and simulate a planar quantum chip layout using Qiskit Metal, which is imported into Ansys HFSS (High Frequency Structure Simulator) to construct a 3D model and perform electromagnetic simulations. A detailed analysis using Driven Modal, Eigenmode, Magnetostatic, and Q3D Capacitance Extraction solvers ensures our simulations accurately reflect physical behavior. The results are validated against analytical models from microwave engineering. pyEPR (Python Energy Participation Ratio) is used to extract key quantum metrics, including eigenfrequencies, quality factors, decoherence times, anharmonicity, cross-Kerr interactions, and participation ratios. Building on this planar design, we extend our study to a 3D-integrated flip-chip architecture featuring two superconducting qubits fabricated on separate high-resistivity silicon substrates. Using HFSS and analytical modeling, we show that detuned qubits maintain stable eigenfrequencies, quality factors, decoherence times, anharmonicity, and cross-Kerr interactions over varying substrate separation values. However, the introduction of dielectric loss tangents reduces quality factors which degrades coherence times and introduces an additional dephasing. These findings highlight the potential of 3D quantum integration, given minimal material imperfections.The planar and 3D designs together form a cohesive investigation into next-generation quantum hardware, with the 2D layout currently taped-out and under fabrication.

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