Publication Date
1994
Degree Type
Thesis
Degree Name
Master of Science (MS)
Department
Materials Engineering
Recommended Citation
Aggarwal, Indu, "The formation of Cu[subscript x]Sn[subscript y] intermetallic compounds in Controlled Collapse Chip Connection (C4)" (1994). Master's Theses. 819.
DOI: https://doi.org/10.31979/etd.fey5-y9em
https://scholarworks.sjsu.edu/etd_theses/819
COinS
