Publication Date
Summer 1995
Degree Type
Master's Project
Degree Name
Master of Science (MS)
Department
General Engineering
First Advisor
Dr. Walter J. Utz, Jr.
Abstract
A study was carried out to characterize the process parameters needed to wire bond soft substrate packages using the thermosonic bonding method. A variety of substrate materials were utilized, including Duroid 5880, Duroid 6010, polyimide, TMM 10, and aluminum oxide. The wires used included aluminum (with a 1% silicon alloy) and high purity gold, with 0.7, 1.0, 1.25 mil gold wire diameters being evaluated. Ceramic and titanium bonding wedges were the tools selected for wire bonding.
Bond pull testing, thermal cycling, and visual examinations were performed to verify the reliability of these wire bonds. Hardness tests were conducted to relate the substrate material properties to the wire bond process parameters.
The results obtained demonstrated the capability to successfully wire bond when using the various substrate materials, wires, and bonding tools mentioned earlier. The range of work stage temperatures, tool temperatures, ultrasonic power levels, bonding times, and bonding forces which produced acceptable wire bonds are presented.
Recommended Citation
Ludtke, Aaron, "Configuration and Control of Multimedia Devices" (1995). Master's Projects. 1848.
DOI: https://doi.org/10.31979/etd.dvpp-x3q4
https://scholarworks.sjsu.edu/etd_projects/1848
