Publication Date

Fall 2021

Degree Type

Thesis

Degree Name

Master of Science (MS)

Department

Mechanical Engineering

Advisor

Farzan Kazemifar

Subject Areas

Mechanical engineering

Abstract

As the power capacity of microelectronics continues to increase while their volume and size decrease, many different on-chip methods including microchannel heat sinks (MCHS) are being explored to cool down the temperature of these electronics. Wavy MCHS have been proven to yield better heat transfer performance compared to straight MCHS, while only producing a slightly larger pressure drop. This study investigates the heat transfer performance of MCHS following a vertical wavy design and a horizontal wavy design that have the same cross-sectional area. The simulations show that vortices are produced along the channel in the peaks and troughs of the sinusoidal waves which creates mixing within the coolant to better dissipate the heat via convection. The vertical wavy design produces to long symmetrical vortices that travel along the side of the channel, while the horizontal wavy design produces four smaller symmetrical vortices that form at the top, middle, and bottom of the channel. The results show that the horizontal wavy design performs better than the straight and vertical wavy channel especially with a larger decrease in wavelength along the flow direction. Keywords – Heat Transfer, Wavy Microchannel Heat Sinks, Computational Fluid Dynamics (CFD)

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